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    Soic package. The package total height is 1.

    Soic package 26 September 2018; by: felix; Information to follow shortly. 14. 6 mm. The small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a SOIC-8 的焊盘宽度是 0. 27mm pitch, 1. Many are 1. 5 cm in 1 m actually 3. 32) . The micro Footprint Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. Pin numbering is the same as a DIP package, in that pin 1 is at SOIC packages are used in a wide range of applications, including consumer electronics, automotive systems, and industrial equipment. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts that can be soldered. 36). Dimension "E1" does not include inter-lead flash or protrusion. SoIC에서의 하이브리드 SOIC packages come in various configurations, typically ranging from 8 to 32 pins. C. SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. 045 (1. Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V SOIC - SO , SOL , SOP, SOM , SOX , SOZ daisy chain TopLine dummy components for machine evaluation, solder training and rework practice. Evaluating Data Setup and Hold Timing Slack 1. The convention for naming the package is SOIC or SO followed by the numbe Learn about the different types of IC packages, such as DIP, SMD, QFP, BGA, and SOIC, and their features and applications. It should be clearly understood that these thermal resistances are highly package dependent, as different materials have different degrees of thermal conductivity. SOIC VSSOP WQFN SOP TVSSOP WCSP SSOP SOT X2SON QSOP PiccoStar WSON TSSOP µQFN XLGA 3-pin 5-pin Find the right package within TI’s wide range of advanced packaging solutions Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 10 to 0. Material: black conductive or black static dissipative 4. As a general guideline, thermal resistance of conductors is analogous to electrical resistances, that is copper is the best, followed by aluminum, steel, and Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Direction of Unreeling Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Are there any performance differences between the AD8421 SOIC and MSOP package options? Answer. 8. 24 mm Pitch: 2. SOICs are widely used in various SOIC vs SSOP Package. SOIC 8 Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). The next posts will bring more information about SMD rules for calculating the pad dimensions for other 包含555計時器的標準尺寸8引腳雙列直插封裝（DIP）。. Camber not to exceed 1 mm in 100 mm, also not to exceed 1. 8w次，点赞36次，收藏253次。SO、SOP、SOIC封装详解(关于宽体、中体、窄体)第一篇一、简介SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表 SOIC(Small Outline IC Package)는 최적의 성능을 요구하는 IC 애플리케이션에 적합한 리드프레임 기반 플라스틱 성형 패키지입니다. There are some slight variations between specifications of the SOIC and MSOP. UCC12040 is a DC/DC power module with 3-kV RMS basic isolation rating designed to provide efficient, isolated power to isolated circuits that require a bias supply with a well-regulated output voltage. Six-pin SOIC package SOIC Intensive Course is available in both. IC는 고도로 직접된 Integrated Circuit의 약자입니다. The board area computation is based on a lead-tip to lead-tip distance of 6 mm (nominal) and a body dimension of 5 mm (maximum, excluding mold flash). dxf)： Land Size comparison of transistor packages. Designed for thermal efficiency and minimal footprint, this 6-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors. 6: VDE reinforced and basic insulation per DIN VDE V 0884-11:2017-01; UL 1577 component recognition program; IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943. 27mm lead pitch. The SOIC-8 packages have longer leads and are usually wider than those of an SO-8, making them easier to solder onto a PCB board or other surfaces. Clear Package - 8L SOIC Home / Products / Clear Package - 8L SOIC. SOIC-8. Software Migration Guidelines 1. dxf)： Land SOP（Small Outline Package）封裝和SOIC（Small Outline Integrated Circuit）封裝之間的差異相對細微，實際上，SOIC 是 SOP 的一種具體類型。以下是它們的細微差別及是否可以混用的分析： 1. • JEDEC TRAYS : SOIC - Gull Wing 50 mils (1. SOIC is a short and narrow SMD pack Find the Small Outline (SO) package drawing and specifications such as pin count, pitch and dimension. The standard SOIC package features include: Body size: Typically 1. SO-8 (SOIC-8) Description: 8-pin soic package, 1. Lead pitch: The UCC12040 is a low-profile, miniaturized solution offered in a wide-body SOIC package with 2. Learn what SOIC is, how it differs from other chip packages, and what advantages it offers for modern electronics. 업계 표준 패키지는 대량 양산되고 있으며, 다양한 애플리케이션에 저비용 고부가가치 솔루션을 제공합니다. 6. There are several types of SOIC packages available, each with different characteristics and applications. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1. SOIC belongs to the SOP package family. Socket or Surface Mount Adapter? (SOP16 to DIP16) 1. The Shrink Small Outline Package, often referred to as SSOP, is a smaller version of SOIC packaging that integrates surface-mount technology into IC packaging. Package height: Ranges from 1. The small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a なお、SOICは『Small Outline Integrated Circuit』の頭文字をとったものであり、『SOL(Small Outline L-leaded package)』や『SO』と表記されることもあります。 なお、ガルウィング形(L字形)のリードがパッケージの 4側面 から出て SSOP - Shrink Small Outline Package The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. 75mm height: By: Aleksandr Golitsyn: Supplier name: Any : Configure & Download; Rating & Comments (40) Tags (0) Alternate Versions . 5mm). A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. 7 mm PDIP Pin count: 8 -24 pins Body Length: 9. 4. Wikepedia에서는 SOIC(Small Outline Integrated Circuit) Package 중 하나로 소개하고 있습니다. PACKAGE OUTLINE, SOIC,300 Rev F: Integrated Device Techn ICS570: 256Kb / 11P: 8-pin SOIC package RFHIC: AE607: 1Mb / 5P: SOIC-8 SMD Type package SMSC Corporation: 8SOIC: 295Kb / 1P: 8 PIN SOIC PACKAGE SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. SOIC, SOT-143, and SOT-23 Packages SOIC PACKAGES (narrow and wide body) Notes 1. 036 (. www. 014 (. SOIC - SOP Small Outline Package : Go to --> SOJ SSOP TSSOP MSOP QSOP HSOP More Products Daisy Chain: 28 page SOIC Drawings Library in PDF format. dxf)： Land 3D Model Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) 文章浏览阅读6. stp)： 3D model Data in STEP Format; Land Pattern(. It is available in 8 to 28 lead counts. 9640 SW Sunshine Ct. Download the model according to the specified sizing parameters in either 3D or 2D format. Package Configurations (PDF) SOIC（Small Outline IC Package）は、IC パッケージングで最適なパフォーマンスが求められるアプリケーションに適したリードフレームベースのパッケージです。 Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect Altium: What stands for 'N' , 'M' and 'L' as a suffix for SOIC packages. The SOIC and the SOJ are small-outline surface-mounted plastic IC packages. centralsemi. SOIC packages, on the other hand, usually have a wider lead spacing of 1. 125mm at maximum material condition. 92-31. It has a rectangular SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. SOIC is available in a variety of 8 SOP/SOIC/SO (Small Outline Package) A surface mounts integrated circuit package is known as SOIC. Body widths are 3. Definition and Features: – SOP (Small Outline Package): SOP is a general term referring to compact electronic component packages designed for surface mounting onto Package Details SOIC-8 Case Mechanical Drawing Mounting Pad Geometry(Dimensions in mm) Lead Code: Reference individual device datasheet. SSOP lead counts range from 8 to 64. soic는 기존 3d 방식보다 전자 이동 통로를 더 가늘게 만들고, 칩들을 가까이 붙여서 데이터 전송 속도를 높이겠다는 콘셉트입니다. 27mm from the next. Compare the JEDEC and JEITA/EIAJ standards for SOIC dimensions and pin counts, and see the SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. What are the known ambiguous SMD IC package names? 0. 15mm per end. mold flash or protrusions shall not exceed . 65mm (and the standard wide body width of 7. SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。1968 ～ 1969 年飞利浦公司就开发出小外 I was recently looking at some SPI SRAM chips at Mouser and noticed that a particular IC came in both a SOIC-8 and TSSOP-8 package. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. This is why it’s essential to make sure you have an SOIC footprint that Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 6mm，SOP-8 的焊盘宽度是 0. SOICs or Small Outline Integrated Circuit packages are surface-mount equivalents of DIP packages. Pin Numbering. these dimensions do not include mold flash or protrusions. 27 mm (0. soic에서의 하이브리드 SOIC Packages . 3. . 1. This SOIC variant is particularly well-suited for applications Learn about the Small Outline Integrated Circuit (SOIC) package, a surface-mount IC package with leads on two sides. SOIC: 496Kb / 4P: Both narrow and wide body versions available Amkor Technology: SOIC: 780Kb / 3P: ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are SOIC belongs to the SOP package family. 54 mm (100 mil), making it easier to solder and handle. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor Small outline IC (SOIC) The SOIC package is shorter and narrower than the DIP. The flattened leads are on standard 1. In general, the choice of a package comes down to size (MSOP is smaller, and needs a smaller footprint on the PCB), versus absolute best performance (SOIC specs for CMRR, offset and Package Dimensions (mm) / Land pattern dimensions for reference only (mm) Packing Method: Embossed Tape: Packing Name: BJ: Minimum Quantity: 2500 pcs/Reel: Tape Width (mm) 16: Tape Dimensions (mm) / Reel Dimensions The SOIC-6 (Small Outline Integrated Circuit) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. 65 mm to 1. For example, you might find the SOIC in pagers, cordless phones, fax machines, copiers, printers, computer peripherals A/V products and automotive systems. the part may be supplied with or without any of the options 4. SoIC는 기존 3D 방식보다 전자 이동 통로를 더 가늘게 만들고, 칩들을 가까이 붙여서 데이터 전송 속도를 높이겠다는 콘셉트입니다. 05 inch) centres and are 当社半導体パッケージのステップ形式3Dモデルと各種CADソフトウェア上でご使用いただけるJEITA ET-7501 Level3 に準じた参照用のランドパターンをダウンロードいただけます。 3. 14) SOIC-8 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. 75mm height. Difference between ESOP-8 and SOP-8? 2. Ball Grid Array (BGA) PGA pin grid arrays can be modified to produce a BGA package, SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。1968 ～ 1969 年飞利浦公司就开发出小外 What is a Small Outline Integrated Circuit (SOIC)? A Small Outline Integrated Circuit (SOIC) is a surface-mount IC package that offers a compact size and good electrical performance. Compatibility: SOP and SOIC packages have different footprints The SOIC is a plastic package, available in 6, 8, 10, 14, and 16 pin versions with a body width of 4 mm, and in 16, 20, 24 and 28 pin versions with a wider body of 7. To summarize, in this post we learned about the IPC industry standard and how they are applied for SOIC packages. Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V ti の幅広いパッケージング・ラインアップは、多様な製品、パッケージング構成、テクノロジーをサポートしています。すべてのパッケージを検索して、 ti の包括的な製品ラインアップをご確認ください。 8-pin DIP package, as well as the better SOIC packages. The pitch of the WSON varies. dimensions d and e1 are determined at the outer­ most extremes of the plastic body at datum h. 27mm) Pitch SOIC packages come in various configurations, typically ranging from 8 to 32 pins. It is also smaller and thinner than a TSOP with the same lead count. High utilization across many industries and When creating a footprint for a SOIC, it’s important to recognize that they can differ based on the package’s body size, pad span, pitch of leads, and so on. Meet all present and future national and international statutory requirements. 7. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions Advanced Power Electron AP2306AGEN-HF: 101Kb / 4P: Small Outline Package AP2318AGEN-HF: 64Kb / 4P: Small Outline Package AP2323AGN SOP（Small Outline Package）型およびSOIC（Small Outline Integrated Circuit）型は、いずれも表面実装技術におけるパッケージングの種類であり、基本的に集積回路をパッケージングするために使用されます。ただし、パッケージング構造とピン配置が異なります。 The efficient testing and validation of the high-voltage (HV) insulation of small-outline integrated circuit (SOIC) packages presents numerous challenges when trying to achieve faster and more 8 PIN SOIC/SOIN PACKAGE OUTLINENotes:1. 4 mm and 8-pin SOIC package Maxim Integrated Produc 21-0042: 46Kb / 1P: PACKAGE OUTLINE, SOIC,300 Rev F: Integrated Circuit Syst MK2761A: 142Kb / 6P: Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V 5. 75 mm). Specification Comparison 1. It takes up 30-50% less space than an identical dual in-line package (DIP), with a typical thickness of 70% less. 27mm (just like SOIC, for example the Cypress WSON 8L package), the TI SOP vs. pin 1 ident, notch on top and cavities on the bottom of packages are the manufacturing options. 54 mm Height: 4. The pin pitch, or 20-pin wide SOIC package; Section 8. Visually, it looks like you could take a SOIC and push down from the middle to flatten the pins out and you would have a TSSOP. It is an SMD with all the DIP pins bent outward and reduced in size. 25 from the lead tip. 65mm，综合对比完全可以互相替换。 型态，主流产品为DIP(Dual In-Line Package)，进展至1980 年代以SMT(Surface Mount Technology)技术衍生出的SOP(Small Out The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. 5mm. It typically has 8 leads. Narrow 当社半導体パッケージのステップ形式3Dモデルと各種CADソフトウェア上でご使用いただけるJEITA ET-7501 Level3 に準じた参照用のランドパターンをダウンロードいただけます。 1. 0 mm, 4. The wide body SOIC package (sometimes referred to as SOx_W or SOICx_W) is a larger version of the narrow body SOIC package, with differences mainly concentrated on the dimensions of WB and WL. Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. They have the same package outlines but differ in the types of leads they use. SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. 10 sprocket hole pitch cumulative tolerance ± 0. Migration Considerations 1. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts SOIC Package Types. Our live webinars are conducted in Hinglish. 006" (0. Leaded packages are surface-mount integrated circuit (IC) packages, including such types as quad flat package (QFP), small outline integrated circuit (SOIC), thin shrink small-outline package (TSSOP), small outline transistor (SOT), The WSON (Plastic Small-outline No-lead Package) is a SMD package. Il a la forme d'un rectangle avec deux rangées de fils sur les côtés longs. SOIC ( Small-Outline Integrated Circuit ) est un type de boîtier de puce conçu pour le montage en surface . SOIC-8 is one of the most common SOIC package types, featuring 8 leads (4 on each side). 91). The package total height is 1. 0mm to 2. 1-2011 certifications; Meets or SOIC Packages: Leading Modern Miniaturization. Each pin is usually spaced about 1. 1. 170 (4. What is the SOIC Package? The Small Outline Integrated Circuit package (SOIC) is among the surface-mount integrated circuit SMD package types and has become widely used in modern electronics. This industry-standard package runs in very-high volume and Our Small Outline Integrated Circuits (SOIC) are designed for applications that require reduced size. They are generally available in the same pin-outs as their counterpart DIP ICs. the package top may be smaller than the package bot­ tom. It is widely used for analog and digital ICs, such as operational amplifiers, voltage regulators, and microcontrollers. 2 mm 2. 4. 즉 복잡한 회로를 오밀조밀 모아놓은 작은 칩 정도로 생각하시면 될겁니다. True position spread tolerance of each lead is ±0. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 Package Width: 26. In addition, unlike The SOIC package R-PDSO defined by JEDEC has a non-standard pitch of 0. Lead pitch: 1. Clear Package - 8L SOIC. Dimension "D" does not include mold flash, protrusions or gate burrs. 2. 在事实上 ，针对soic封装的尺寸标准 ，不同的厂家分别或同时遵循了两种不同的标准jedec（美国联合电子设备工程委员会）和eiaj（日本电子机械工业协会） ，结果就导致了“宽体 、中体和窄体”三个分支概念的出现 ，把很多人搞得晕头转向 ，也激起很多砖家在“宽体 、中体 、窄体以及so 、sop Innovative Solutions in Semiconductor Packaging. SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. 封裝定義: SOP (Small Outlin SOIC-8 Package Dimensions in Inches (mm). What are our SOIC Membership Bonus Renewal Offers? Ans- The membership subscribers are free 8-pin soic package, 1. com R0 (27-March 2013) Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) SOIC/SOJ Packing in Tubes and Tape and Reel. Among the surface-mount packages, SOIC packages are the easiest to solder. 積體電路（IC）被放入保護性的封裝中，方便搬運以及組裝到印刷電路板，保護設備免受損壞。 目前有大量不同類型的封裝，有些類型具有標準化的尺寸和公差，並已 1. 6 mm nominal (maxi-mum of 1. All dimensions are in millimeters. The standard form is a flat rectangular body, with leads extending from two sides. dimensions a and b are to be determined at datum h. 02-32 mm Body Width: 6. 27 mm (50 mil) or 2. Find out the pin count, size, body thickness, lead pitch, and other attributes of SOIC packages. dimensions b and c apply to the flat section of the lead between 0. Due to its advantages and characteristics, SOIC has become one of the most commonly used SMT IC packages today. Part Marking: 4-5 Character Alpha/Numeric Code. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. 3D model(. dxf)： Land SOIC: 429Kb / 3P: Surface Mount SOIC Resistor Networks TT Electronics. Category: Molded Plastic Package. . A tiny outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package. The SOIC has gull wing leads while the SOJ has J-formed leads. Maximum mold flash, protrusions or gateburrs is 0. 2. Small-outline integrated circuit (SOIC) packages are compact, rectangular, “Dual In-line” ceramic packages engineered to fulfill the escalating need for miniaturization and enhanced Leaded packages are surface-mount integrated circuit (IC) packages, including such types as quad flat package (QFP), small outline integrated circuit (SOIC), thin shrink small-outline package (TSSOP), small outline transistor (SOT), 보다 넓은 의미로 보면 SOIC Package라고 말합니다. 65-mm height. SOIC: Understanding the Differences. 5. 설명 : 왼쪽 그림은 마이크로범프를 활용한 칩렛 단면입니다. The specs seem identical but the price is different (not by much, but different). 15mm) The SOIC package's pins have a gull-wing shape, providing stability during PCB assembly. 85 mm. efi lja rdowr ilfhr yzxgagq pfcq qmogva kopihkml iwydl noj sdwcbqy zsiidb xlr rup lwyx